Power Integrity for I/O Interfaces

Power Integrity for I/O Interfaces

Author: Vishram S. Pandit

Publisher: Pearson Education

ISBN: 9780132596961

Category: Technology & Engineering

Page: 384

View: 151

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Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Power Integrity for I/O Interfaces

Power Integrity for I/O Interfaces

Author: Vishram S. Pandit

Publisher:

ISBN: OCLC:1027177182

Category:

Page: 417

View: 179

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Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB p.

Power Distribution Network Design Methodologies

Power Distribution Network Design Methodologies

Author: Istvan Novak

Publisher: Intl. Engineering Consortiu

ISBN: 1931695652

Category: Computers

Page: 544

View: 252

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A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.

Advanced Computing

Advanced Computing

Author: Deepak Garg

Publisher: Springer Nature

ISBN: 9789811604041

Category: Computers

Page: 375

View: 679

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This two-volume set (CCIS 1367-1368) constitutes reviewed and selected papers from the 10th International Advanced Computing Conference, IACC 2020, held in December 2020. The 65 full papers and 2 short papers presented in two volumes were thorougly reviewed and selected from 286 submissions. The papers are organized in the following topical sections: Application of Artificial Intelligence and Machine Learning in Healthcare; Using Natural Language Processing for Solving Text and Language related Applications; Using Different Neural Network Architectures for Interesting applications; ​Using AI for Plant and Animal related Applications.- Applications of Blockchain and IoT.- Use of Data Science for Building Intelligence Applications; Innovations in Advanced Network Systems; Advanced Algorithms for Miscellaneous Domains; New Approaches in Software Engineering.

Real-Time Modelling and Processing for Communication Systems

Real-Time Modelling and Processing for Communication Systems

Author: Muhammad Alam

Publisher: Springer

ISBN: 9783319722153

Category: Technology & Engineering

Page: 282

View: 794

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This book presents cutting-edge work on real-time modelling and processing, a highly active research field in both the research and industrial domains. Going beyond conventional real-time systems, major efforts are required to develop accurate and computational efficient real-time modelling algorithms and design automation tools that reflect the technological advances in high-speed and ultra-low-power transceiver communication architectures based on nanoscale devices. The book addresses basic and more advanced topics, such as I/O buffer circuits for ensuring reliable chip-to-chip communication, I/O buffer behavioural modelling, multiport empirical models for memory interfaces, compact behavioural modelling for memristive devices, and resource reservation modelling for distributed embedded systems. The respective chapters detail new research findings, new models, algorithms, implementations and simulations of the above-mentioned topics. As such, the book will help both graduate students and researchers understand the latest research into real-time modelling and processing.

Rapid System Prototyping with FPGAs

Rapid System Prototyping with FPGAs

Author: RC Cofer

Publisher: Elsevier

ISBN: 9780080457376

Category: Computers

Page: 320

View: 249

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The push to move products to market as quickly and cheaply as possible is fiercer than ever, and accordingly, engineers are always looking for new ways to provide their companies with the edge over the competition. Field-Programmable Gate Arrays (FPGAs), which are faster, denser, and more cost-effective than traditional programmable logic devices (PLDs), are quickly becoming one of the most widespread tools that embedded engineers can utilize in order to gain that needed edge. FPGAs are especially popular for prototyping designs, due to their superior speed and efficiency. This book hones in on that rapid prototyping aspect of FPGA use, showing designers exactly how they can cut time off production cycles and save their companies money drained by costly mistakes, via prototyping designs with FPGAs first. Reading it will take a designer with a basic knowledge of implementing FPGAs to the “next-level of FPGA use because unlike broad beginner books on FPGAs, this book presents the required design skills in a focused, practical, example-oriented manner. In-the-trenches expert authors assure the most applicable advice to practicing engineers Dual focus on successfully making critical decisions and avoiding common pitfalls appeals to engineers pressured for speed and perfection Hardware and software are both covered, in order to address the growing trend toward "cross-pollination" of engineering expertise

High Speed Digital Design

High Speed Digital Design

Author: Hanqiao Zhang

Publisher: Elsevier

ISBN: 9780124186675

Category: Technology & Engineering

Page: 272

View: 743

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High Speed Digital Design discusses the major factors to consider in designing a high speed digital system and how design concepts affect the functionality of the system as a whole. It will help you understand why signals act so differently on a high speed digital system, identify the various problems that may occur in the design, and research solutions to minimize their impact and address their root causes. The authors offer a strong foundation that will help you get high speed digital system designs right the first time. Taking a systems design approach, High Speed Digital Design offers a progression from fundamental to advanced concepts, starting with transmission line theory, covering core concepts as well as recent developments. It then covers the challenges of signal and power integrity, offers guidelines for channel modeling, and optimizing link circuits. Tying together concepts presented throughout the book, the authors present Intel processors and chipsets as real-world design examples. Provides knowledge and guidance in the design of high speed digital circuits Explores the latest developments in system design Covers everything that encompasses a successful printed circuit board (PCB) product Offers insight from Intel insiders about real-world high speed digital design

High-Speed Signaling

High-Speed Signaling

Author: Kyung Suk (Dan) Oh

Publisher: Prentice Hall

ISBN: 9780132827119

Category: Technology & Engineering

Page: 527

View: 453

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New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.

Timing Analysis and Simulation for Signal Integrity Engineers

Timing Analysis and Simulation for Signal Integrity Engineers

Author: Greg Edlund

Publisher: Pearson Education

ISBN: 9780132797184

Category: Technology & Engineering

Page: 272

View: 646

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Every day, companies call upon their signal integrity engineers to make difficult decisions about design constraints and timing margins. Can I move these wires closer together? How many holes can I drill in this net? How far apart can I place these chips? Each design is unique: there’s no single recipe that answers all the questions. Today’s designs require ever greater precision, but design guides for specific digital interfaces are by nature conservative. Now, for the first time, there’s a complete guide to timing analysis and simulation that will help you manage the tradeoffs between signal integrity, performance, and cost. Writing from the perspective of a practicing SI engineer and team lead, Greg Edlund of IBM presents deep knowledge and quantitative techniques for making better decisions about digital interface design. Edlund shares his insights into how and why digital interfaces fail, revealing how fundamental sources of pathological effects can combine to create fault conditions. You won’t just learn Edlund’s expert techniques for avoiding failures: you’ll learn how to develop the right approach for your own projects and environment. Coverage includes • Systematically ensure that interfaces will operate with positive timing margin over the product’s lifetime–without incurring excess cost • Understand essential chip-to-chip timing concepts in the context of signal integrity • Collect the right information upfront, so you can analyze new designs more effectively • Review the circuits that store information in CMOS state machines–and how they fail • Learn how to time common-clock, source synchronous, and high-speed serial transfers • Thoroughly understand how interconnect electrical characteristics affect timing: propagation delay, impedance profile, crosstalk, resonances, and frequency-dependent loss • Model 3D discontinuities using electromagnetic field solvers • Walk through four case studies: coupled differential vias, land grid array connector, DDR2 memory data transfer, and PCI Express channel • Appendices present a refresher on SPICE modeling and a high-level conceptual framework for electromagnetic field behavior Objective, realistic, and practical, this is the signal integrity resource engineers have been searching for. Preface xiii Acknowledgments xvi About the Author xix About the Cover xx Chapter 1: Engineering Reliable Digital Interfaces 1 Chapter 2: Chip-to-Chip Timing 13 Chapter 3: Inside IO Circuits 39 Chapter 4: Modeling 3D Discontinuities 73 Chapter 5: Practical 3D Examples 101 Chapter 6: DDR2 Case Study 133 Chapter 7: PCI Express Case Study 175 Appendix A: A Short CMOS and SPICE Primer 209 Appendix B: A Stroll Through 3D Fields 219 Endnotes 233 Index 235

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

Author: Riko Radojcic

Publisher: Springer

ISBN: 9783319525488

Category: Technology & Engineering

Page: 182

View: 891

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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition

An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition

Author: Jose Moreira

Publisher: Artech House

ISBN: 9781608079865

Category: Technology & Engineering

Page: 706

View: 132

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This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.